Dalingshan Town Party Secretary Cai Guowei Visits Tongke Electronics for Research and Guidance
On the morning of March 11, 2026, Cai Guowei, Party Secretary of Dalingshan Town, and Vice Mayor Huang Zhili visited Tongke Electronics for research and guidance. Chairman Zhong Pingquan and senior executives of the company warmly received the delegation.
As a national-level Specialized, Sophisticated, Distinctive, and Innovative "Little Giant" enterprise, Tongke Electronics has long been deeply engaged in semiconductor chip design and power device packaging and testing. Its products are widely applied in strategic emerging fields such as automotive electronics and new energy, making it an important force in the high-quality development of Dongguan's semiconductor industry. During the visit, Secretary Cai Guowei and his team detailed the company's development status and technological innovation progress, with particular concern for challenges the company faces in key areas such as land use and talent recruitment.
Secretary Cai Guowei on-site promoted government policies on industrial support, talent recruitment, and land use guarantees. He coordinated directly and implemented targeted measures for the company's needs, effectively translating policy benefits into tangible outcomes for enterprise development. This demonstrated the town Party committee and government's firm determination and sense of responsibility in proactively serving and fully supporting the high-quality development of enterprises.
This research visit was both a deep engagement between government and enterprise and an affirmation and encouragement of Tongke Electronics' dedication to the semiconductor field and its commitment to innovation. Looking ahead, Tongke Electronics will leverage policy support to continue deepening its core technologies, strengthening industry-university-research collaboration, and empowering industrial upgrading through technological innovation, contributing "Tongke Strength" to the high-quality development of the semiconductor industry in Dalingshan Town and Dongguan City.
Development Milestone
- 2020：Established the Semiconductor Integrated Circuit Engineering Technology Research Center, adopted fully automated packaging and testing processes, achieved rapid output growth, and was included in Guangdong Province's key semiconductor packaging and testing technology transformation projects.
- 2021：Awarded the title of national-level Specialized, Sophisticated, Distinctive, and Innovative "Little Giant" Enterprise; selected as a Dongguan Doubling Plan Enterprise and Dalingshan Town Doubling Plan Enterprise; established the Dongguan Enterprise Technology Center; launched industry-university-research cooperation with Southern University of Science and Technology, Shanghai Institute of Technology, Jiangnan University, and Dongguan University of Technology in semiconductor packaging, testing, and IC design; developed 60 patents.
- 2022：Recognized as a Dongguan Doubling Plan Pilot Enterprise and Dongguan Engineering Technology Research Center; successfully selected as a Dongguan Listed Reserve Enterprise; awarded the Dongguan Small Signal Key Laboratory.
- 2023：Honored with the title of Dongguan Single Champion Enterprise.
- 2024：Passed the review for the third batch of national-level Specialized, Sophisticated, Distinctive, and Innovative "Little Giant" Enterprises thanks to its outstanding innovation capability, key technologies, and products.
- 2025：Awarded the titles of Guangdong Provincial Postdoctoral Workstation and Guangdong Provincial Manufacturing Single Champion Enterprise.
Corporate Vision
To create a respected Chinese national brand, become a benchmark enterprise in the global semiconductor industry, and build a century-old happy enterprise.
Corporate Mission
To provide customers with high-quality products and value-added services, create wealth and help employees realize their dreams, and contribute to society.
Core Values
Customer First, Quality First, Scientific Innovation, Integrity-Based Management.
