Company News
Tongke Electronics New Year Greeting: United Forward, Chip Future!
A fresh year begins. With gratitude for 2025 and confidence in 2026, Tongke Electronics moves forward with employees, customers, suppliers, and partners.
Dear Tongke family, partners, and friends from all walks of life: as time moves on and the year turns anew, Dongguan Tongke Electronics Co., Ltd. extends our sincerest holiday greetings and best New Year wishes to all employees, customers, suppliers, and everyone who cares about and supports Tongke's development.
Looking Back at 2025: Dedicated Growth, Semiconductor Responsibility
Over the past year, as a long-time practitioner in semiconductor power device packaging and testing, Tongke Electronics has continued to grow steadily in a market filled with both challenges and opportunities, always driven by technological innovation and guided by customer needs.
This year, we continued to improve packaging and testing processes and optimize production workflows. We added capacity in TO-252, PDFN5x6, and PDFN3x3 packaging and testing, achieving a new production breakthrough. We also strengthened strategic cooperation with upstream and downstream partners to build a more stable and efficient semiconductor supply chain. By upholding quality as our lifeline and refining every product with craftsmanship, we earned strong recognition from our customers and a solid reputation in the market.
These achievements would not have been possible without the hard work and dedication of every Tongke team member, the trust and support of our partners, and the vibrant opportunities brought by this great era to the semiconductor industry. We express our heartfelt thanks to everyone who has contributed to Tongke's development.
Looking Ahead to 2026: Ambition in Chips, Steady Progress into a New Journey
With a new year comes a renewed world. In 2026, the global semiconductor industry will continue moving forward through transformation, and power devices, as the core of energy conversion and management, are becoming increasingly important. Tongke Electronics will uphold our values of "customer first, quality first, scientific innovation, and integrity as the foundation," and meet new challenges and opportunities with greater confidence and energy.
In the new year, we firmly believe that focus leads to professionalism and innovation leads to leadership. Tongke Electronics will continue striving toward our vision of becoming a world-class semiconductor power device packaging and testing service provider, contributing solid packaging and testing strength to the development of China's semiconductor industry.
New Year Wishes: Connected by Chips, Embracing Good Things Together
In this beautiful moment of farewell to the old and welcome to the new, we sincerely wish:
- All Tongke employees and their families a happy New Year, good health, family happiness, and all the best.
- All customers and partners continued success and even greater achievements in our cooperation.
- All friends who care about and support Tongke a peaceful, joyful, and warm year ahead.
Let us carry our beautiful vision of the future of chips, stand side by side, and welcome the new sunrise of 2026 with steadfast faith and solid steps.
May our great nation prosper, and may its people live in peace and well-being.
About Tongke Electronics
Founded in 2010, Dongguan Tongke Electronics Co., Ltd. is a national high-tech enterprise specializing in semiconductor discrete devices, chip testing, and integrated circuit R&D, design, and manufacturing. Our products are widely used in smart wearables, 5G products, automotive electronics, drones, AI, IoT, communications, lighting, power supplies, home appliances, smart home systems, computers, and smart instruments.
Development Milestones
- 2020: Established the "Semiconductor Integrated Circuit Engineering Technology Research Center," adopted fully automated packaging and testing processes, achieved rapid production growth, and was included in Guangdong's key semiconductor packaging and testing technology transformation projects.
- 2021: Received the national "Little Giant" specialized and innovative enterprise title, was selected as a Dongguan Multiplying Enterprise and Dalingshan Multiplying Enterprise, established a Dongguan Enterprise Technology Center, and launched industry-academia-research cooperation in semiconductor packaging and testing and IC design with Southern University of Science and Technology, Shanghai Institute of Technology, Jiangnan University, and Dongguan University of Technology, developing 60 patents.
- 2022: Recognized as a Dongguan "Multiplication Plan Pilot Enterprise" and a Dongguan "Engineering Technology Research Center," successfully selected as a Dongguan listed reserve enterprise, and awarded the Dongguan Small-Signal Key Laboratory.
- 2023: Honored as a "Dongguan Single Champion Enterprise."
- 2024: Passed the third batch of national "Little Giant" enterprise re-evaluation thanks to outstanding innovation capabilities, key technologies, and products.
- 2025: Awarded the "Guangdong Province Postdoctoral Workstation."
Vision
Build a proud Chinese brand, become a benchmark enterprise in the global semiconductor industry, and create a century-long happy enterprise.
Mission
Provide customers with high-quality products and exceptional service, create wealth and opportunities for employees, and contribute to society.
Values
Customer first, quality first, scientific innovation, and integrity as the foundation.
