PDFN5 MOSFET

PDFN5 MOSFET
Details:
For the PDFN5*6-8L series, CTK highlights the design reason behind this package: larger DFN-style power package with stronger thermal capacity and lower resistance focus. This page is meant for engineers checking thermal planning, board constraints, and sourcing continuity
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Description
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CTKG100N10DF5 100V/100A N-Channel Power MOSFET | Product Details

 

CTKG100N10DF5 100V/100A

 

PDFN5X6-8L N-Channel Split-Gate Power MOSFET

Mass Production | Automotive-Grade Screening

 

 

CTKG100N10DF5 is a high-current N-channel power MOSFET designed for medium-voltage high-power conversion and load control circuits. It balances ultra-low conduction resistance with optimized switching performance. Every unit undergoes 100% UIS avalanche and Vds dynamic voltage screening, ensuring stable electrical performance and superior surge immunity for consumer energy storage, power tools, industrial control, and automotive auxiliary power equipment. Housed in a compact PDFN5×6-8L surface-mount package, it serves as a reliable drop-in replacement for imported power MOSFETs.

pdfn5 mosfet 100A 100V

 

Core Electrical Specifications

Absolute Maximum Ratings (TJ=25°C)

Drain-Source Voltage VDS 100V Gate-Source Voltage VGS ±20V
Continuous Drain Current ID 100A (TC=25°C) ;
60A (TC=100°C)
Pulsed Drain Current IDM 400A
Single Pulse Avalanche Energy EAS 144mJ Power Dissipation PD 147W
Junction-to-Case RθJC 0.85 °C/W Operating & Storage Temp -55°C ~ 150°C

 

 
 
Key Features

RDS(on) typ. 6.5mΩ (VGS=10V) 

Qg only 29nC, low Miller charge

ton=8.4ns, toff=27ns

Body diode trr=45ns, Qrr=53nC

 

Key Electrical Characteristics (TJ=25°C

 

Conduction Performance:Typical RDS(on)=6.5mΩ (max 8.4mΩ) @ VGS=10V, ID=30A. Low on-resistance cuts power loss significantly under sustained heavy current.
Dynamic Switching:Total gate charge Qg=29nC, Miller charge Qgd=8.4nC. Turn-on delay 8.4ns, rise 9.4ns; turn-off delay 27ns, fall 18ns.
Body Diode:Continuous 100A forward current, trr=45ns, Qrr=53nC – eliminates external Schottky.
Breakdown & Leakage:V(BR)DSS≥100V; IDSS≤1mA, gate leakage ≤±100nA.

 

 

PDFN5×6-8L Package Advantages

 

Multi-pin parallel current distribution - Four paralleled D pins on top, S pins on bottom reduce parasitic inductance and solder joint heating.

Large exposed thermal pad - Full-size bottom pad with RθJC=0.85°C/W, direct heat transfer to PCB.

Anti-reverse mounting - PIN1 dot marker prevents SMT misplacement.

Universal industry footprint - Standard PDFN5×6-8L pad layout, drop-in replacement for competing parts.

SMT-friendly - Compatible with high-speed pick-and-place, excellent reflow yield.

 

Factory Reliability Screening

 

CTKG100N10DF5 undergoes 100% inspection for two critical tests:

UIS (Unclamped Inductive Switching) - verifies single-pulse avalanche energy tolerance against inductive kickback.

ΔVds dynamic voltage stress - screens latent dielectric defects to prevent mid-life breakdown.

EAS up to 144mJ ensures robust transient surge immunity, extending equipment MTBF.

 

Main Application Scenarios

Load Switch Circuits

Portable power station / Li-ion PACK main switches

Multi-port PD fast charger power path

BMS overcurrent / short-circuit protection

Hot-swap industrial control boards

PWM High-Frequency Conversion

Synchronous Buck/Boost DC-DC converters

PV energy storage inverters

BLDC motor low-side drives

Servo drivers

Industrial & Automotive Power

AC-DC industrial / communication power supplies

Automotive low-voltage auxiliary distribution

UPS backup power loops

High-power LED drivers / welding auxiliary

 

 
Order & Packaging Information
Package form:
13'' Tape & Reel
Reel quantity:
5,000 pcs
Carton quantity:
50,000 pcs 
Marking:
CTKG100N10DF5

Stable mass production, cost-effective alternative to other brand MOSFETs.

Product Selection Summary

 

CTKG100N10DF5 integrates 100V withstand voltage, 100A continuous current, 6.5mΩ ultra-low on-resistance, and Split-Gate trench technology, combined with a thermally optimized PDFN5×6-8L package and 100% reliability screening. For hardware engineers, it resolves core pain points such as excessive heating, surge weakness, and PCB space constraints. For procurement, standardized packaging, pin-compatible replacement, and stable delivery streamline supply chain and reduce BOM costs. The preferred high-performance N-channel power MOSFET for mass-produced consumer energy storage, power tools, industrial control, and automotive power equipment.

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